Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7410832 | Semiconductor chip package having an adhesive tape attached on bonding wires | Sang-Yeop Lee | 2008-08-12 |
| 7227086 | Semiconductor chip package having an adhesive tape attached on bonding wires | Sang-Yeop Lee | 2007-06-05 |
| 7096914 | Apparatus for bonding a chip using an insulating adhesive tape | Dong-Kuk Kim, Sang-Yeop Lee, Chang-Cheol Lee | 2006-08-29 |
| 7005577 | Semiconductor chip package having an adhesive tape attached on bonding wires | Sang-Yeop Lee | 2006-02-28 |