Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7315077 | Molded leadless package having a partially exposed lead frame pad | Yoon-hwa Choi, O-seob Jeon, Rajeev Joshi, Maria Cristina Estacio | 2008-01-01 |
| 7199461 | Semiconductor package suitable for high voltage applications | Joon-seo Son, O-seob Jeon | 2007-04-03 |
| 6756689 | Power device having multi-chip package structure | O-seob Jun | 2004-06-29 |
| 6742561 | Apparatus for die bonding | Dong-Kuk Kim | 2004-06-01 |
| 6621152 | Thin, small-sized power semiconductor package | Yoon-hwa Choi | 2003-09-16 |
| 6025651 | Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads | — | 2000-02-15 |
| 5965947 | Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads | Seung-Kon Mok, Dae-Hoon Kwon | 1999-10-12 |