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Molded leadless package having a partially exposed lead frame pad |
Yoon-hwa Choi, O-seob Jeon, Rajeev Joshi, Maria Cristina Estacio |
2008-01-01 |
| 7199461 |
Semiconductor package suitable for high voltage applications |
Joon-seo Son, O-seob Jeon |
2007-04-03 |
| 6756689 |
Power device having multi-chip package structure |
O-seob Jun |
2004-06-29 |
| 6742561 |
Apparatus for die bonding |
Dong-Kuk Kim |
2004-06-01 |
| 6621152 |
Thin, small-sized power semiconductor package |
Yoon-hwa Choi |
2003-09-16 |
| 6025651 |
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads |
— |
2000-02-15 |
| 5965947 |
Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads |
Seung-Kon Mok, Dae-Hoon Kwon |
1999-10-12 |
