Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848243 | Molded semiconductor package having a substrate with bevelled edge | Man-kyo Jong | 2023-12-19 |
| 11004698 | Power module package | Keunhyuk LEE, Oseob Jeon, Seungwon IM | 2021-05-11 |
| 9666512 | Semiconductor package | Seung-won IM, O-seob Jeon | 2017-05-30 |
| 9130065 | Power module having stacked flip-chip and method for fabricating the power module | Seungwon IM, O-seob Jeon, Keun-hyuk Lee, Yun Hwa CHOI | 2015-09-08 |
| 8945992 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | O-seob Jeon, Taek-keun Lee, Byoung-ok Lee | 2015-02-03 |
| 8860196 | Semiconductor package and method of fabricating the same | Joo-yang Eom | 2014-10-14 |
| 8766419 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, O-seob Jeon, Keun-kyuk Lee, Yun Hwa CHOI | 2014-07-01 |
| 8723304 | Semiconductor package and methods of fabricating the same | In-goo Kang, O-seob Jeon | 2014-05-13 |
| 8552541 | Power device packages having thermal electric modules using peltier effect and methods of fabricating the same | Seung-won Lim, O-soeb Jeon, Byoung-ok Lee, Man-kyo Jong | 2013-10-08 |
| 8067826 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | O-seob Jeon, Taek-keun Lee, Byoung-ok Lee | 2011-11-29 |
| 7863725 | Power device packages and methods of fabricating the same | Man-kyo Jong, Seung-won Lim, O-soeb Jeon | 2011-01-04 |
| 7816784 | Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same | Romel N. Manatad, Armand Vincent C. Jereza | 2010-10-19 |
| 7714455 | Semiconductor packages and methods of fabricating the same | O-soeb Jeon | 2010-05-11 |
| 7687903 | Power module and method of fabricating the same | Seung-won Lim, O-seob Jeon | 2010-03-30 |
| 7675148 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, O-seob Jeon, Keun-hyuk Lee, Yun Hwa CHOI | 2010-03-09 |
| 7199461 | Semiconductor package suitable for high voltage applications | Shi-baek Nam, O-seob Jeon | 2007-04-03 |