Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796831 | Complex semiconductor packages and methods of fabricating the same | Gwi-gyeon Yang | 2014-08-05 |
| 8766419 | Power module having stacked flip-chip and method of fabricating the power module | O-seob Jeon, Joon-seo Son, Keun-kyuk Lee, Yun Hwa CHOI | 2014-07-01 |
| 8604606 | Heat sink package | Joo-yang Eom, O-seob Jeon, Seung-yong Choi | 2013-12-10 |
| 8552541 | Power device packages having thermal electric modules using peltier effect and methods of fabricating the same | O-soeb Jeon, Joon-seo Son, Byoung-ok Lee, Man-kyo Jong | 2013-10-08 |
| 8350369 | High power semiconductor package | Keun-hyuk Lee, Sung Min Park, Taek-keun Lee | 2013-01-08 |
| 8258622 | Power device package and semiconductor package mold for fabricating the same | Keun-hyuk Lee, Sung Min Park | 2012-09-04 |
| 7986531 | Power system module and method of fabricating the same | Keun-hyuk Lee, Seung-Han Paek, Sung Min Park | 2011-07-26 |
| 7951645 | Power module for low thermal resistance and method of fabricating the same | Keun-hyuk Lee, O-seob Jeon | 2011-05-31 |
| 7863725 | Power device packages and methods of fabricating the same | Man-kyo Jong, Joon-seo Son, O-soeb Jeon | 2011-01-04 |
| 7847395 | Package and package assembly of power device | Seung-han Baek | 2010-12-07 |
| 7808103 | Leadless package | Sung Min Park, Keun-hyuk Lee | 2010-10-05 |
| 7786570 | Heat sink package | Joo-yang Eom, O-seob Jeon, Seung-yong Choi | 2010-08-31 |
| 7714428 | High power semiconductor package and method of making the same | Keun-hyuk Lee | 2010-05-11 |
| 7706146 | Power system module and method of fabricating the same | Keun-hyuk Lee, Seung-Han Paek, Sung Min Park | 2010-04-27 |
| 7701048 | Power module for low thermal resistance and method of fabricating the same | Keun-hyuk Lee, O-seob Jeon | 2010-04-20 |
| 7687903 | Power module and method of fabricating the same | Joon-seo Son, O-seob Jeon | 2010-03-30 |
| 7675148 | Power module having stacked flip-chip and method of fabricating the power module | O-seob Jeon, Joon-seo Son, Keun-hyuk Lee, Yun Hwa CHOI | 2010-03-09 |
| 7501700 | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same | Gi-Young Jeun, O-Seob Jeun, Eun Ho Lee | 2009-03-10 |
| 7449774 | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same | Gi-Young Jeun, O-Seob Jeun, Eun Ho Lee | 2008-11-11 |
| 6574107 | Stacked intelligent power module package | O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung Jin Kim, Eul-bin Im +1 more | 2003-06-03 |