Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666512 | Semiconductor package | Seung-won IM, Joon-seo Son | 2017-05-30 |
| 9130065 | Power module having stacked flip-chip and method for fabricating the power module | Seungwon IM, Joon-seo Son, Keun-hyuk Lee, Yun Hwa CHOI | 2015-09-08 |
| 8945992 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | Joon-seo Son, Taek-keun Lee, Byoung-ok Lee | 2015-02-03 |
| 8766419 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, Joon-seo Son, Keun-kyuk Lee, Yun Hwa CHOI | 2014-07-01 |
| 8723304 | Semiconductor package and methods of fabricating the same | In-goo Kang, Joon-seo Son | 2014-05-13 |
| 8604606 | Heat sink package | Joo-yang Eom, Seung-won Lim, Seung-yong Choi | 2013-12-10 |
| 8067826 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package | Joon-seo Son, Taek-keun Lee, Byoung-ok Lee | 2011-11-29 |
| 7951645 | Power module for low thermal resistance and method of fabricating the same | Keun-hyuk Lee, Seung-won Lim | 2011-05-31 |
| 7800224 | Power device package | Joo-Sang Lee, Yong-suk Kwon, Frank Chen, Adams Zhu | 2010-09-21 |
| 7786570 | Heat sink package | Joo-yang Eom, Seung-won Lim, Seung-yong Choi | 2010-08-31 |
| 7701048 | Power module for low thermal resistance and method of fabricating the same | Keun-hyuk Lee, Seung-won Lim | 2010-04-20 |
| 7687903 | Power module and method of fabricating the same | Joon-seo Son, Seung-won Lim | 2010-03-30 |
| 7675148 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, Joon-seo Son, Keun-hyuk Lee, Yun Hwa CHOI | 2010-03-09 |
| 7315077 | Molded leadless package having a partially exposed lead frame pad | Yoon-hwa Choi, Shi-baek Nam, Rajeev Joshi, Maria Cristina Estacio | 2008-01-01 |
| 7208819 | Power module package having improved heat dissipating capability | Gi-Young Jeun, Sung Min Park, Joo-Sang Lee, Sung Won LIM, Byoung-ok Lee +2 more | 2007-04-24 |
| 7199461 | Semiconductor package suitable for high voltage applications | Joon-seo Son, Shi-baek Nam | 2007-04-03 |
| 7061080 | Power module package having improved heat dissipating capability | Gi-Young Jeun, Sung Min Park, Joo-Sang Lee, Sung Won LIM, Byoung-ok Lee +2 more | 2006-06-13 |
| 6774465 | Semiconductor power package module | Keun-hyuk Lee, Ji Hwan Kim, Dae-Woong Chung | 2004-08-10 |
| 6710439 | Three-dimensional power semiconductor module and method of manufacturing the same | Keun-hyuk Lee, Gi-Young Jeun | 2004-03-23 |
| 6574107 | Stacked intelligent power module package | Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung Jin Kim, Eul-bin Im +1 more | 2003-06-03 |