Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929116 | Electronic device module and method of manufacturing the same | — | 2018-03-27 |
| 9706661 | Electronic device module and manufacturing method thereof | — | 2017-07-11 |
| 9673123 | Electronic device module and method of manufacturing the same | — | 2017-06-06 |
| 9510461 | Electric component module and method of manufacturing the same | Il Hyeong LEE, Jae-Cheon Doh | 2016-11-29 |
| 9147627 | Flip chip MLP with conductive ink | Ti Ching Shian, Maria Cristina Estacio | 2015-09-29 |
| 8604606 | Heat sink package | Joo-yang Eom, O-seob Jeon, Seung-won Lim | 2013-12-10 |
| 8168475 | Semiconductor package formed within an encapsulation | Min-hyo Park | 2012-05-01 |
| 7936054 | Multi-chip package | Joo-yang Eom, Min-hyo Park | 2011-05-03 |
| 7786570 | Heat sink package | Joo-yang Eom, O-seob Jeon, Seung-won Lim | 2010-08-31 |
| 7638861 | Flip chip MLP with conductive ink | Ti Ching Shian, Maria Cristina Estacio | 2009-12-29 |
| 7632719 | Wafer-level chip scale package and method for fabricating and using the same | Min-hyo Park, Ji Hwan Kim, Rajeev Joshi | 2009-12-15 |
| 7492043 | Power module flip chip package | Jonathan Almeria Noquil | 2009-02-17 |
| 7335532 | Method of assembly for multi-flip chip on lead frame on overmolded IC package | Jonathan Almeria Noquil, Rajeev Joshi, Chung-Lin Wu | 2008-02-26 |
| 7268414 | Semiconductor package having solder joint of improved reliability | Seung-Han Paek | 2007-09-11 |
| 7154186 | Multi-flip chip on lead frame on over molded IC package and method of assembly | Jonathan Almeria Noquil, Rajeev Joshi, Chung-Lin Wu | 2006-12-26 |
| 6574107 | Stacked intelligent power module package | O-seob Jeon, Gi-young Jeon, Seung-won Lim, Seung Jin Kim, Eul-bin Im +1 more | 2003-06-03 |