Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9147627 | Flip chip MLP with conductive ink | Seung-yong Choi, Maria Cristina Estacio | 2015-09-29 |
| 8058107 | Semiconductor die package using leadframe and clip and method of manufacturing | Erwin Victor Cruz, Elsie Agdon Cabahug, Venkat Iyer | 2011-11-15 |
| 7638861 | Flip chip MLP with conductive ink | Seung-yong Choi, Maria Cristina Estacio | 2009-12-29 |
| 7285849 | Semiconductor die package using leadframe and clip and method of manufacturing | Erwin Victor Cruz, Elsie Agdon Cabahug, Venkat Iyer | 2007-10-23 |