Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8860196 | Semiconductor package and method of fabricating the same | Joon-seo Son | 2014-10-14 |
| 8604606 | Heat sink package | O-seob Jeon, Seung-won Lim, Seung-yong Choi | 2013-12-10 |
| 7936054 | Multi-chip package | Min-hyo Park, Seung-yong Choi | 2011-05-03 |
| 7786570 | Heat sink package | O-seob Jeon, Seung-won Lim, Seung-yong Choi | 2010-08-31 |