Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8168475 | Semiconductor package formed within an encapsulation | Seung-yong Choi | 2012-05-01 |
| 7936054 | Multi-chip package | Joo-yang Eom, Seung-yong Choi | 2011-05-03 |
| 7728437 | Semiconductor package form within an encapsulation | Soung-yong Choi | 2010-06-01 |
| 7632719 | Wafer-level chip scale package and method for fabricating and using the same | Seung-yong Choi, Ji Hwan Kim, Rajeev Joshi | 2009-12-15 |