Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6574107 | Stacked intelligent power module package | O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung Jin Kim +1 more | 2003-06-03 |
| 6432750 | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof | Gi-young Jeon, Byeong Gon KIM, Eun Ho Lee | 2002-08-13 |