Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8138081 | Aluminum bump bonding for fine aluminum wire | Xingquan Fang, Fred Ren, Yongsuk Kwon | 2012-03-20 |
| 7800224 | Power device package | Joo-Sang Lee, O-seob Jeon, Yong-suk Kwon, Frank Chen | 2010-09-21 |