Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400991 | Clip structure for semiconductor package and semiconductor package including the same | — | 2025-08-26 |
| 12170260 | Semiconductor package and method of manufacturing the same | — | 2024-12-17 |
| D1049065 | Semiconductor package | — | 2024-10-29 |
| 12027445 | System for cooling semiconductor component, method of manufacturing the same, and semiconductor package having the system | — | 2024-07-02 |
| 11908766 | Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined | — | 2024-02-20 |
| 11908824 | Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor package | — | 2024-02-20 |
| 11823920 | Apparatus for attaching semiconductor parts | Jung Min Park | 2023-11-21 |
| 11798864 | Semiconductor package with metal post having non-vertical structure | — | 2023-10-24 |
| 11721615 | Coupled semiconductor package | — | 2023-08-08 |
| 11682610 | Semiconductor package with heat radiation board | Younghun Kim, Jeonghun Cho | 2023-06-20 |
| 11676931 | Semiconductor package | Jeonghun Cho, Young Hun Kim, Taeheon Lee | 2023-06-13 |
| 11631627 | Method of manufacturing semiconductor having double-sided substrate | — | 2023-04-18 |
| 11521920 | Plurality of power semiconductor chips between a substrate and leadframe | — | 2022-12-06 |
| 11482463 | Vertically attaching a chip to a substrate | Jeonghun Cho | 2022-10-25 |
| 11417577 | Semiconductor package and method of manufacturing the same | — | 2022-08-16 |
| 11393744 | Metal powder layers between substrate, semiconductor chip and conductor | — | 2022-07-19 |
| 11367666 | Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same | Jeong Hun Cho, Soon Seong Choi | 2022-06-21 |
| 11362021 | Pressurizing members for semiconductor package | Jeonghun Cho | 2022-06-14 |
| 11289397 | Heat sink board for a semiconductor device | Young Hun Kim, Jeonghun Cho, So Young Choi | 2022-03-29 |
| 11270969 | Semiconductor package | Jeonghun Cho, Young Hun Kim, Taeheon Lee | 2022-03-08 |
| 11189550 | Low-cost semiconductor package using conductive metal structure | In Suk Choi | 2021-11-30 |
| 11171074 | Heat sink board, manufacturing method thereof, and semiconductor package including the same | Jeonghun Cho | 2021-11-09 |
| 11127663 | Semiconductor package having exposed heat sink for high thermal conductivity | — | 2021-09-21 |
| 10896889 | Multilayer clip structure attached to a chip | Young Hun Kim, Tae Heon Lee, Jeong Hun Cho | 2021-01-19 |
| 10855009 | Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin | Soon Seong Choi, Jeong Hun Cho | 2020-12-01 |