Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682610 | Semiconductor package with heat radiation board | Yun Hwa CHOI, Younghun Kim | 2023-06-20 |
| 11676931 | Semiconductor package | Yun Hwa CHOI, Young Hun Kim, Taeheon Lee | 2023-06-13 |
| 11482463 | Vertically attaching a chip to a substrate | Yun Hwa CHOI | 2022-10-25 |
| 11362021 | Pressurizing members for semiconductor package | Yun Hwa CHOI | 2022-06-14 |
| 11289397 | Heat sink board for a semiconductor device | Yun Hwa CHOI, Young Hun Kim, So Young Choi | 2022-03-29 |
| 11270969 | Semiconductor package | Yun Hwa CHOI, Young Hun Kim, Taeheon Lee | 2022-03-08 |
| 11171074 | Heat sink board, manufacturing method thereof, and semiconductor package including the same | Yun Hwa CHOI | 2021-11-09 |
| 11056420 | Pressing-type semiconductor power device package | Yunhwa Choi, Jungtae Cho | 2021-07-06 |
| 10438873 | Semiconductor chip package having heat dissipating structure | Yunhwa Choi | 2019-10-08 |
| 10204848 | Semiconductor chip package having heat dissipating structure | Yunhwa Choi | 2019-02-12 |