Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11123400 | Broken or folded helical peptide or peptide analog exhibiting antimicrobial activity against gram-negative bacteria, and use thereof | Jaehoon Yu, Yan Lee, Soonsil Hyun, Seo Yeon Kim, Sun-Mi Jin +2 more | 2021-09-21 |
| 11056420 | Pressing-type semiconductor power device package | Jeonghun Cho, Jungtae Cho | 2021-07-06 |
| 10438873 | Semiconductor chip package having heat dissipating structure | Jeonghun Cho | 2019-10-08 |
| 10256207 | Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package | — | 2019-04-09 |
| 10204848 | Semiconductor chip package having heat dissipating structure | Jeonghun Cho | 2019-02-12 |