Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367666 | Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same | Yun Hwa CHOI, Jeong Hun Cho | 2022-06-21 |
| 10855009 | Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin | Yun Hwa CHOI, Jeong Hun Cho | 2020-12-01 |
| 10541197 | Press-fit pin and semiconductor package including the same | Yun Hwa CHOI, Jeong Hun Cho | 2020-01-21 |
| 10249552 | Semiconductor package having double-sided heat dissipation structure | Yun Hwa CHOI | 2019-04-02 |