Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714450 | Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the same | SoonSeong Choi | 2020-07-14 |
| 10541197 | Press-fit pin and semiconductor package including the same | Soon Seong Choi, Jeong Hun Cho | 2020-01-21 |
| 10535589 | Clip structure and semiconductor package using the same | Armand Vincent C. Jereza | 2020-01-14 |
| 10249552 | Semiconductor package having double-sided heat dissipation structure | Soon Seong Choi | 2019-04-02 |
| 9685397 | Semiconductor package with clip structure | — | 2017-06-20 |
| 9130065 | Power module having stacked flip-chip and method for fabricating the power module | Seungwon IM, O-seob Jeon, Joon-seo Son, Keun-hyuk Lee | 2015-09-08 |
| 8766419 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, O-seob Jeon, Joon-seo Son, Keun-kyuk Lee | 2014-07-01 |
| 8538453 | Location tracking method in coordinator-based wireless network | Hyong-uk Choi | 2013-09-17 |
| 8504057 | Location tracking method in coordinator-based wireless network | Hyong-uk Choi | 2013-08-06 |
| 7957340 | Method of allocating frequency subband and apparatus adopting the same | Hyong-uk Choi | 2011-06-07 |
| 7675148 | Power module having stacked flip-chip and method of fabricating the power module | Seung-won Lim, O-seob Jeon, Joon-seo Son, Keun-hyuk Lee | 2010-03-09 |
| 7551594 | Method of allocating frequency subband and apparatus adopting the same | Hyong-uk Choi | 2009-06-23 |