Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1095474 | Power module package | Jeonghyuk Park, Keunhyuk LEE, Jerome Teysseyre, Paolo BILARDO | 2025-09-30 |
| 12417999 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Jooyang EOM | 2025-09-16 |
| 12368085 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Dongwook Kang, Oseob Jeon | 2025-07-22 |
| 12315826 | Semiconductor device package assemblies with direct leadframe attachment | Oseob Jeon | 2025-05-27 |
| 12300689 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE | 2025-05-13 |
| 12272615 | Thermal mismatch reduction in semiconductor device modules | Oseob Jeon | 2025-04-08 |
| 12230606 | Semiconductor package and related methods | Oseob Jeon, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2025-02-18 |
| 12230551 | Immersion direct cooling modules | Oseob Jeon, Youngsun KO, Jerome Teysseyre, Michael J. Seddon | 2025-02-18 |
| 12230601 | High power module package structures | Jooyang EOM, Inpil Yoo, Oseob Jeon | 2025-02-18 |
| 12211771 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE | 2025-01-28 |
| 12205918 | Submodule semiconductor package | Jooyang EOM, Maria Cristina Estacio, Jerome Teysseyre, Inpil Yoo | 2025-01-21 |
| 12142551 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2024-11-12 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Jooyang EOM | 2024-05-14 |
| 11967540 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2024-04-23 |
| 11961782 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Dongwook Kang, Oseob Jeon | 2024-04-16 |
| 11901309 | Semiconductor device package assemblies with direct leadframe attachment | Oseob Jeon | 2024-02-13 |
| 11658171 | Dual cool power module with stress buffer layer | Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE | 2023-05-23 |
| 11652030 | Power module and related methods | Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE | 2023-05-16 |
| 11615967 | Power module package and method of manufacturing the same | Keunhyuk LEE, Oseob Jeon, Joonseo SON | 2023-03-28 |
| 11545421 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2023-01-03 |
| 11521921 | Semiconductor device package assemblies and methods of manufacture | Jeungdae KIM, Oseob Jeon | 2022-12-06 |
| 11264311 | Clips for semiconductor package and related methods | Inpil Yoo, Jooyang EOM, Jerome Teysseyre | 2022-03-01 |
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2021-12-14 |
| 11145571 | Heat transfer for power modules | Inpil Yoo, Jerome Teysseyre, Dongwook Kang | 2021-10-12 |
| 11101198 | Semiconductor die package including a one-body clip | Joonseo SON, Oseob Jeon | 2021-08-24 |