| D1095474 |
Power module package |
Jeonghyuk Park, Keunhyuk LEE, Jerome Teysseyre, Paolo BILARDO |
2025-09-30 |
|
| 12417999 |
Semiconductor packages using package in package systems and related methods |
Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Jooyang EOM |
2025-09-16 |
|
| 12368085 |
Integration of semiconductor device assemblies with thermal dissipation mechanisms |
Dongwook Kang, Oseob Jeon |
2025-07-22 |
|
| 12315826 |
Semiconductor device package assemblies with direct leadframe attachment |
Oseob Jeon |
2025-05-27 |
|
| 12300689 |
Dual cool power module with stress buffer layer |
Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE |
2025-05-13 |
|
| 12272615 |
Thermal mismatch reduction in semiconductor device modules |
Oseob Jeon |
2025-04-08 |
|
| 12230551 |
Immersion direct cooling modules |
Oseob Jeon, Youngsun KO, Jerome Teysseyre, Michael J. Seddon |
2025-02-18 |
|
| 12230601 |
High power module package structures |
Jooyang EOM, Inpil Yoo, Oseob Jeon |
2025-02-18 |
|
| 12230606 |
Semiconductor package and related methods |
Oseob Jeon, Joonseo SON, Mankyo Jong, Olaf Zschieschang |
2025-02-18 |
|
| 12211771 |
Power module and related methods |
Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE |
2025-01-28 |
|
| 12205918 |
Submodule semiconductor package |
Jooyang EOM, Maria Cristina Estacio, Jerome Teysseyre, Inpil Yoo |
2025-01-21 |
|
| 12142551 |
Package including multiple semiconductor devices |
Jerome Teysseyre, Maria Cristina Estacio |
2024-11-12 |
$91,050,000 |
| 11984424 |
Semiconductor packages using package in package systems and related methods |
Inpil Yoo, Maria Cristina Estacio, Jerome Teysseyre, Jooyang EOM |
2024-05-14 |
$24,866,000 |
| 11967540 |
Integrated circuit direct cooling systems having substrates in contact with a cooling medium |
Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more |
2024-04-23 |
$287,477,000 |
| 11961782 |
Integration of semiconductor device assemblies with thermal dissipation mechanisms |
Dongwook Kang, Oseob Jeon |
2024-04-16 |
$133,930,000 |
| 11901309 |
Semiconductor device package assemblies with direct leadframe attachment |
Oseob Jeon |
2024-02-13 |
$83,842,000 |
| 11658171 |
Dual cool power module with stress buffer layer |
Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE |
2023-05-23 |
$86,922,000 |
| 11652030 |
Power module and related methods |
Jonghwan BAEK, Jeonghyuk Park, Keunhyuk LEE |
2023-05-16 |
$45,536,000 |
| 11615967 |
Power module package and method of manufacturing the same |
Keunhyuk LEE, Oseob Jeon, Joonseo SON |
2023-03-28 |
$50,071,000 |
| 11545421 |
Package including multiple semiconductor devices |
Jerome Teysseyre, Maria Cristina Estacio |
2023-01-03 |
$68,577,000 |
| 11521921 |
Semiconductor device package assemblies and methods of manufacture |
Jeungdae KIM, Oseob Jeon |
2022-12-06 |
$56,851,000 |
| 11264311 |
Clips for semiconductor package and related methods |
Inpil Yoo, Jooyang EOM, Jerome Teysseyre |
2022-03-01 |
$87,271,000 |
| 11201105 |
Semiconductor package having a spacer with a junction cooling pipe |
Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more |
2021-12-14 |
$39,059,000 |
| 11145571 |
Heat transfer for power modules |
Inpil Yoo, Jerome Teysseyre, Dongwook Kang |
2021-10-12 |
$28,470,000 |
| 11101198 |
Semiconductor die package including a one-body clip |
Joonseo SON, Oseob Jeon |
2021-08-24 |
$27,734,000 |