Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037907 | Semiconductor package and related methods | Oseob Jeon, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2021-06-15 |
| 11031379 | Stray inductance reduction in packaged semiconductor devices | Byoungok LEE, Oseob Jeon | 2021-06-08 |
| 11004698 | Power module package | Keunhyuk LEE, Oseob Jeon, Joon-seo Son | 2021-05-11 |
| 10910297 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2021-02-02 |
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2020-03-31 |
| 10586754 | Semiconductor die package and manufacturing method | Mankyo Jong, Joonseo SON | 2020-03-10 |
| 10403601 | Semiconductor package and related methods | Oseob Jeon, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2019-09-03 |
| 10319670 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2019-06-11 |
| 10090279 | Stray inductance reduction in packaged semiconductor devices and modules | Mankyo Jong, Byoungok LEE, Joonseo SON, Oseob Jeon | 2018-10-02 |
| 9130065 | Power module having stacked flip-chip and method for fabricating the power module | O-seob Jeon, Joon-seo Son, Keun-hyuk Lee, Yun Hwa CHOI | 2015-09-08 |