Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230606 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Olaf Zschieschang | 2025-02-18 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Olaf Zschieschang | 2021-06-15 |
| 10658342 | Vertically stacked multichip modules | Changyoung Park | 2020-05-19 |
| 10586754 | Semiconductor die package and manufacturing method | Seungwon IM, Joonseo SON | 2020-03-10 |
| 10483237 | Vertically stacked multichip modules | Changyoung Park | 2019-11-19 |
| 10403601 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Olaf Zschieschang | 2019-09-03 |
| 10090279 | Stray inductance reduction in packaged semiconductor devices and modules | Seungwon IM, Byoungok LEE, Joonseo SON, Oseob Jeon | 2018-10-02 |