Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394692 | Power circuit module | Atapol Prajuckamol, Chee Hiong CHEW | 2025-08-19 |
| 12230606 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Mankyo Jong | 2025-02-18 |
| 11081828 | Power module housing | Jihwan Kim, Yushuang YAO, Bosung WON, Atapol Prajuckamol | 2021-08-03 |
| D922329 | Press-fit pin case | Jihwan Kim, Yushuang YAO, Bosung WON, Atapol Prajuckamol | 2021-06-15 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Mankyo Jong | 2021-06-15 |
| 10403601 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Mankyo Jong | 2019-09-03 |
| 10304788 | Semiconductor power module to protect against short circuit event | Jihwan Kim, Heeyoung Song, Gwigyeon Yang | 2019-05-28 |
| 9210818 | Power semiconductor module with asymmetrical lead spacing | Andreas Laschek-Enders | 2015-12-08 |
| 9042103 | Power semiconductor module with asymmetrical lead spacing | Andreas Laschek-Enders | 2015-05-26 |
| 7780469 | Arrangement of at least one power semiconductor module and a printed circuit board | Andreas Laschek-Enders | 2010-08-24 |