| 12230606 |
Semiconductor package and related methods |
Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang |
2025-02-18 |
| 11967540 |
Integrated circuit direct cooling systems having substrates in contact with a cooling medium |
Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more |
2024-04-23 |
| 11615967 |
Power module package and method of manufacturing the same |
Keunhyuk LEE, Oseob Jeon, Seungwon IM |
2023-03-28 |
| 11201105 |
Semiconductor package having a spacer with a junction cooling pipe |
Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more |
2021-12-14 |
| 11101198 |
Semiconductor die package including a one-body clip |
Seungwon IM, Oseob Jeon |
2021-08-24 |
| 11037907 |
Semiconductor package and related methods |
Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang |
2021-06-15 |
| 10607919 |
Semiconductor package having junction cooling pipes embedded in substrates |
Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more |
2020-03-31 |
| 10586754 |
Semiconductor die package and manufacturing method |
Seungwon IM, Mankyo Jong |
2020-03-10 |
| 10403601 |
Semiconductor package and related methods |
Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang |
2019-09-03 |
| 10090279 |
Stray inductance reduction in packaged semiconductor devices and modules |
Seungwon IM, Mankyo Jong, Byoungok LEE, Oseob Jeon |
2018-10-02 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Paul Armand Asentista Calo, Margie T. Rios, Tiburcio A. Maldo, Erwin Ian V. Almagro |
2009-09-08 |