Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230606 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang | 2025-02-18 |
| 11967540 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more | 2024-04-23 |
| 11615967 | Power module package and method of manufacturing the same | Keunhyuk LEE, Oseob Jeon, Seungwon IM | 2023-03-28 |
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more | 2021-12-14 |
| 11101198 | Semiconductor die package including a one-body clip | Seungwon IM, Oseob Jeon | 2021-08-24 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang | 2021-06-15 |
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more | 2020-03-31 |
| 10586754 | Semiconductor die package and manufacturing method | Seungwon IM, Mankyo Jong | 2020-03-10 |
| 10403601 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang | 2019-09-03 |
| 10090279 | Stray inductance reduction in packaged semiconductor devices and modules | Seungwon IM, Mankyo Jong, Byoungok LEE, Oseob Jeon | 2018-10-02 |
| 7586179 | Wireless semiconductor package for efficient heat dissipation | Paul Armand Asentista Calo, Margie T. Rios, Tiburcio A. Maldo, Erwin Ian V. Almagro | 2009-09-08 |