| D1095474 |
Power module package |
Seungwon IM, Jeonghyuk Park, Jerome Teysseyre, Paolo BILARDO |
2025-09-30 |
| 12354930 |
Module with substrate recess for conductive-bonding component |
Leo GU, Sixin JI, Jie Chang, Yong Liu |
2025-07-08 |
| 12300689 |
Dual cool power module with stress buffer layer |
Jonghwan BAEK, Jeonghyuk Park, Seungwon IM |
2025-05-13 |
| 12266590 |
Dual side direct cooling semiconductor package |
Inpil Yoo, Jerome Teysseyre, Oseob Jeon, Michael J. Seddon |
2025-04-01 |
| 12211771 |
Power module and related methods |
Jonghwan BAEK, Jeonghyuk Park, Seungwon IM |
2025-01-28 |
| 12119576 |
Press-fit power module and related methods |
Jie Chang, Huibin Chen, Tiburcio A. Maldo |
2024-10-15 |
| 12074160 |
Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads |
Tiburcio A. Maldo, Jerome Teysseyre |
2024-08-27 |
| 11908826 |
Flexible clip with aligner structure |
Jerome Teysseyre, Tiburcio A. Maldo |
2024-02-20 |
| 11776871 |
Module with substrate recess for conductive-bonding component |
Leo GU, Sixin JI, Jie Chang, Yong Liu |
2023-10-03 |
| 11658171 |
Dual cool power module with stress buffer layer |
Jonghwan BAEK, Jeonghyuk Park, Seungwon IM |
2023-05-23 |
| 11652030 |
Power module and related methods |
Jonghwan BAEK, Jeonghyuk Park, Seungwon IM |
2023-05-16 |
| 11615967 |
Power module package and method of manufacturing the same |
Oseob Jeon, Joonseo SON, Seungwon IM |
2023-03-28 |
| 11315856 |
Leadframe with sockets for solderless pins |
Tiburcio A. Maldo |
2022-04-26 |
| 11222832 |
Power semiconductor device package |
Tiburcio A. Maldo, Jerome Teysseyre |
2022-01-11 |
| 11127651 |
High power module semiconductor package with multiple submodules |
Jie Chang, Huibin Chen, Jerome Tysseyre |
2021-09-21 |
| 11004698 |
Power module package |
Oseob Jeon, Joon-seo Son, Seungwon IM |
2021-05-11 |
| 10804626 |
Press-fit power module and related methods |
Jie Chang, Huibin Chen, Tiburcio A. Maldo |
2020-10-13 |
| 10741480 |
Leadframe with sockets for solderless pins |
Tiburcio A. Maldo |
2020-08-11 |
| 10566713 |
Press-fit power module and related methods |
Jie Chang, Huibin Chen, Tiburcio A. Maldo |
2020-02-18 |
| 10553517 |
High power module semiconductor package with multiple submodules |
Jie Chang, Huibin Chen, Jerome Teysseyre |
2020-02-04 |
| 8890310 |
Power module package having excellent heat sink emission capability and method for manufacturing the same |
Oseob Jeon, Seungwon Lim |
2014-11-18 |