Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1079658 | Data cable | Huazhong Liu, Yanfeng Chen | 2025-06-17 |
| 12322678 | Encapsulation structure and encapsulation method of power module | Haiyan Liu | 2025-06-03 |
| 12119576 | Press-fit power module and related methods | Jie Chang, Tiburcio A. Maldo, Keunhyuk LEE | 2024-10-15 |
| 11935817 | Power device module with dummy pad die layout | Yusheng LIN, Jerome Teysseyre | 2024-03-19 |
| 11594510 | Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Yusheng LIN | 2023-02-28 |
| 11127651 | High power module semiconductor package with multiple submodules | Jie Chang, Keunhyuk LEE, Jerome Tysseyre | 2021-09-21 |
| 10991670 | Semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Yusheng LIN | 2021-04-27 |
| 10804626 | Press-fit power module and related methods | Jie Chang, Tiburcio A. Maldo, Keunhyuk LEE | 2020-10-13 |
| 10566713 | Press-fit power module and related methods | Jie Chang, Tiburcio A. Maldo, Keunhyuk LEE | 2020-02-18 |
| 10553517 | High power module semiconductor package with multiple submodules | Jie Chang, Keunhyuk LEE, Jerome Teysseyre | 2020-02-04 |