Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354910 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-08 |
| 12347728 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-01 |
| 12322649 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Shu-Cheng Chin, Chih-Chien Chi, Hung-Wen Su +1 more | 2025-06-03 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh +4 more | 2024-09-17 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2024-09-03 |
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Kai-Shiang Kuo, Chun-Sheng Chen, Wen-Hsuan Chen | 2023-12-26 |
| 11676898 | Diffusion barrier for semiconductor device and method | Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee +3 more | 2023-06-13 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2022-08-30 |
| 8951909 | Integrated circuit structure and formation | Chun-Chieh Lin, Hung-Wen Su | 2015-02-10 |
| 8367545 | System and method for monitoring copper barrier layer preclean process | Kuo-Liang Sung | 2013-02-05 |