Issued Patents All Time
Showing 1–25 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334397 | Interconnect structure including graphite and method forming same | Shu-Cheng Chin, Chih-Yi Chang, Wei Hsiang Chan, Chih-Chien Chi, Chi-Feng Lin | 2025-06-17 |
| 12322649 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Shu-Cheng Chin, Chih-Chien Chi, Cheng-Hui Weng +1 more | 2025-06-03 |
| 12315809 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee +2 more | 2025-05-27 |
| 12237261 | Semiconductor device having a contact structure | Shu-Cheng Chin, Yao-Min Liu, Chih-Chien Chi, Chi-Feng Lin | 2025-02-25 |
| 12166128 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2024-12-10 |
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 12159838 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2024-12-03 |
| 12159837 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Ming-Hsing Tsai, Syun-Ming Jang | 2024-12-03 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh +4 more | 2024-09-17 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2024-09-03 |
| 11996361 | Method of making a contact structure | Shu-Cheng Chin, Yao-Min Liu, Chih-Chien Chi, Chi-Feng Lin | 2024-05-28 |
| 11908697 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2024-02-20 |
| 11851749 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Chih-Chien Chi | 2023-12-26 |
| 11830742 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Pei-Hsuan Lee, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2023-11-28 |
| 11810857 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee +2 more | 2023-11-07 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2023-10-03 |
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2023-08-29 |
| 11682624 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2023-06-20 |
| 11676898 | Diffusion barrier for semiconductor device and method | Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee +3 more | 2023-06-13 |
| 11652044 | Contact structure and method of making | Shu-Cheng Chin, Yao-Min Liu, Chih-Chien Chi, Chi-Feng Lin | 2023-05-16 |
| 11552018 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Ming-Hsing Tsai, Syun-Ming Jang | 2023-01-10 |
| 11535950 | Electro-plating and apparatus for performing the same | Chen-Yuan Kao, Minghsing Tsai | 2022-12-27 |
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2022-12-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Ya-Lien Lee +2 more | 2022-12-13 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2022-08-30 |