Issued Patents All Time
Showing 51–75 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10050116 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Ming-Hsing Tsai, Rueijer Lin, Sheng-Hsuan Lin +2 more | 2018-08-14 |
| 9978681 | Semiconductor device | Shih-Wei Chou, Ming-Hsing Tsai | 2018-05-22 |
| 9953868 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2018-04-24 |
| 9917058 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2018-03-13 |
| 9892963 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2018-02-13 |
| 9887073 | Physical vapor deposition system and physical vapor depositing method using the same | Chih-Chien Chi, Pei-Hsuan Lee | 2018-02-06 |
| 9818834 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Ming-Hsing Tsai, Rueijer Lin, Sheng-Hsuan Lin +2 more | 2017-11-14 |
| 9812397 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ken-Yu Chang, Ya-Lien Lee | 2017-11-07 |
| 9805951 | Method of integration process for metal CMP | Chih-Chien Chi, Pei-Hsuan Lee | 2017-10-31 |
| 9786604 | Metal cap apparatus and method | Chen-Yuan Kao, Chih-Yi Chang, Liang-Yueh Ou Yang | 2017-10-10 |
| 9754882 | Interconnect structure having air gap and method of forming the same | Chih-Chien Chi | 2017-09-05 |
| 9632498 | Systems and methods of compensating for filling material losses in electroplating processes | Chih-Yi Chang, Liang-Yueh Ou Yang, Chen-Yuan Kao | 2017-04-25 |
| 9564398 | Chemical direct pattern plating interconnect metallization and metal structure produced by the same | Wen-Jiun Liu, Chen-Yuan Kao, Mingh-Hsing Tsai, Syun-Ming Jang | 2017-02-07 |
| 9518334 | Electro-plating and apparatus for performing the same | Chen-Yuan Kao, Minghsing Tsai | 2016-12-13 |
| 9520362 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2016-12-13 |
| 9496169 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2016-11-15 |
| 9476135 | Electro chemical plating process | Chih-Yi Chang, Liang-Yueh Ou Yang, Chen-Yuan Kao | 2016-10-25 |
| 9343294 | Interconnect structure having air gap and method of forming the same | Chih-Chien Chi | 2016-05-17 |
| 9269612 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2016-02-23 |
| 9240378 | Method of forming a copper layer using physical vapor deposition | Ken-Yu Chang | 2016-01-19 |
| 9218970 | Stress-controlled formation of TiN hard mask | Rueijer Lin, Chun-Chieh Lin, Ming-Hsing Tsai | 2015-12-22 |
| 9214383 | Method of semiconductor integrated circuit fabrication | Wen-Jiun Liu, Chien-An Chen, Ya-Lien Lee, Minghsing Tsai, Syun-Ming Jang | 2015-12-15 |
| 9209073 | Metal cap apparatus and method | Liang-Yueh Ou Yang, Chih-Yi Chang, Chen-Yuan Kao | 2015-12-08 |
| 9159666 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Yu-Hung Lin, Kuei-Pin Lee, Yu-Min Chang | 2015-10-13 |
| 9123781 | Semiconductor device and method for forming the same | Shih-Wei Chou, Ming-Hsing Tsai | 2015-09-01 |