Issued Patents All Time
Showing 76–94 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9029260 | Gap filling method for dual damascene process | Chun-Chieh Lin, Minghsing Tsai, Syun-Ming Jang | 2015-05-12 |
| 8975187 | Stress-controlled formation of tin hard mask | Rueijer Lin, Chun-Chieh Lin, Minghsing Tsai | 2015-03-10 |
| 8962473 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ken-Yu Chang, Ya-Lien Lee | 2015-02-24 |
| 8951909 | Integrated circuit structure and formation | Cheng-Hui Weng, Chun-Chieh Lin | 2015-02-10 |
| 8736056 | Device for reducing contact resistance of a metal | Ya-Lien Lee | 2014-05-27 |
| 7803896 | Polyimide-titania hybrid materials, their preparation, and film prepared from the materials | Wen-Chang Chen | 2010-09-28 |
| 7749896 | Semiconductor device and method for forming the same | Shih-Wei Chou, Ming-Hsing Tsai | 2010-07-06 |
| 7597787 | Methods and apparatuses for electrochemical deposition | Ming-Hsing Tsai | 2009-10-06 |
| 7538434 | Copper interconnection with conductive polymer layer and method of forming the same | Chien-Hsueh Shih, Minghsing Tsai, Shau-Lin Shue | 2009-05-26 |
| 7476306 | Method and apparatus for electroplating | Chien-Hsueh Shih, Ming-Hsing Tsai | 2009-01-13 |
| 7413976 | Uniform passivation method for conductive features | Chien-Hsueh Shih, Minghsing Tsai | 2008-08-19 |
| 7332435 | Silicide structure for ultra-shallow junction for MOS devices | Chien-Hsueh Shih, Shih-Wei Chou, Minghsing Tsai | 2008-02-19 |
| 7312531 | Semiconductor device and fabrication method thereof | Hui-Lin Chang, Yung-Cheng Lu, Chung-Chi Ko, Pi-Tsung Chen, Shau-Lin Shue +2 more | 2007-12-25 |
| 7259463 | Damascene interconnect structure with cap layer | Jui Jen Huang, Minghsing Tsai, Shau-Lin Shue, Ting-Chu Ko | 2007-08-21 |
| 7256124 | Method of fabricating semiconductor device | Keng-Chu Lin, Yi-Chi Liao, Hung Chun Tsai, Yung-Cheng Lu | 2007-08-14 |
| 7226860 | Method and apparatus for fabricating metal layer | Hsien-Ming Lee, Jing-Cheng Lin, Shing-Chyang Pan, Ming-Hsing Tsai, Shih-Wei Chou +3 more | 2007-06-05 |
| 7101790 | Method of forming a robust copper interconnect by dilute metal doping | Hsien-Ming Lee | 2006-09-05 |
| 7091126 | Method for copper surface smoothing | Han-Hsin Kuo, Wen-Chih Chiou, Tsu Shih, Hsien-Ming Lee | 2006-08-15 |
| 6797144 | Method for reducing surface defects in an electrodeposition process | Shih-Wei Chou, Ching-Hua Hsieh, Shau-Lin Shue | 2004-09-28 |