Issued Patents All Time
Showing 26–50 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380542 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Pei-Hsuan Lee, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2022-07-05 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2022-06-28 |
| 11345991 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Chih-Chien Chi | 2022-05-31 |
| 11177168 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2021-11-16 |
| 11062909 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2021-07-13 |
| 11018055 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Kuan-Chia Chen | 2021-05-25 |
| 11004793 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2021-05-11 |
| 10998269 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Ming-Hsing Tsai, Syun-Ming Jang | 2021-05-04 |
| 10867800 | Method of forming an interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2020-12-15 |
| 10790142 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hsiao-Kuan Wei, Pei-Hsuan Lee, Hsin-Yun Hsu, Jui-Fen Chien | 2020-09-29 |
| 10770288 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Pei-Hsuan Lee, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2020-09-08 |
| 10727350 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2020-07-28 |
| 10692814 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Ming-Hsing Tsai, Syun-Ming Jang | 2020-06-23 |
| 10529575 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2020-01-07 |
| 10522399 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Kuan-Chia Chen | 2019-12-31 |
| 10508356 | Electro-plating and apparatus for performing the same | Chen-Yuan Kao, Minghsing Tsai | 2019-12-17 |
| 10504832 | Method for manufacturing copper layer | Ken-Yu Chang | 2019-12-10 |
| 10438846 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Kuan-Chia Chen | 2019-10-08 |
| 10340223 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2019-07-02 |
| 10312098 | Method of forming an interconnect structure | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2019-06-04 |
| 10276431 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2019-04-30 |
| 10262944 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2019-04-16 |
| 10199500 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2019-02-05 |
| 10163644 | Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2018-12-25 |
| 10163719 | Method of forming self-alignment contact | Hsiao-Ping Liu, Hung-Chang Hsu, Ming-Hsing Tsai, Rueijer Lin, Sheng-Hsuan Lin +3 more | 2018-12-25 |