Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354910 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-08 |
| 12347728 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-01 |
| 12166128 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2024-12-10 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh +4 more | 2024-09-17 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2024-09-03 |
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Huei-Wen Hsieh, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2023-12-26 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2023-10-03 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2022-08-30 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2022-06-28 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2022-05-10 |
| 10840134 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2020-11-17 |
| 10727350 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2020-07-28 |
| 10269627 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2019-04-23 |
| 10199500 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Po-Cheng Shih +1 more | 2019-02-05 |
| 9812397 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Ken-Yu Chang, Ya-Lien Lee, Hung-Wen Su | 2017-11-07 |
| 9754822 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao +3 more | 2017-09-05 |
| 8962473 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Ken-Yu Chang, Ya-Lien Lee, Hung-Wen Su | 2015-02-24 |