Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400862 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Chun-Sheng Chen, Nai-Hao Yang, Kuan-Chia Chen, Yu-Cheng Hsiao +1 more | 2025-08-26 |
| 12354910 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-08 |
| 12347728 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2025-07-01 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Kai-Shiang Kuo +4 more | 2024-09-17 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2024-09-03 |
| 11854878 | Bi-layer alloy liner for interconnect metallization and methods of forming the same | Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen | 2023-12-26 |
| 11694899 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Chun-Sheng Chen, Nai-Hao Yang, Kuan-Chia Chen, Yu-Cheng Hsiao +1 more | 2023-07-04 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng +2 more | 2022-08-30 |