SC

Shu-Cheng Chin

TSMC: 13 patents #2,298 of 12,232Top 20%
Overall (All Time): #361,081 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12394717 Graphite-based interconnects and methods of fabrication thereof Chih-Chien Chi 2025-08-19
12354958 Semiconductor devices and methods of formation Chih-Chien Chi, Hsin-Ying Peng, Jau-Jiun Huang, Ya-Lien Lee, Kuan-Chia Chen +2 more 2025-07-08
12334397 Interconnect structure including graphite and method forming same Chih-Yi Chang, Wei Hsiang Chan, Chih-Chien Chi, Chi-Feng Lin, Hung-Wen Su 2025-06-17
12322649 Interconnect structure of semiconductor device Yao-Min Liu, Chia-Pang Kuo, Chih-Chien Chi, Cheng-Hui Weng, Hung-Wen Su +1 more 2025-06-03
12315764 Conductive structures with barriers and liners of varying thicknesses Chih-Chien Chi, Chi-Feng Lin 2025-05-27
12255144 Graphene liners and caps for semiconductor structures Chih-Yi Chang, Chih-Chien Chi, Ming-Hsing Tsai 2025-03-18
12237261 Semiconductor device having a contact structure Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi, Chi-Feng Lin 2025-02-25
12165975 Method of forming interconnect structure having a barrier layer Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng, Chih-Hsiang Chang +4 more 2024-12-10
12094770 Ruthenium-based liner for a copper interconnect Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Huei-Wen Hsieh, Kai-Shiang Kuo +4 more 2024-09-17
11996361 Method of making a contact structure Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi, Chi-Feng Lin 2024-05-28
11749604 Ruthenium oxide film and ruthenium liner for low-resistance copper interconnects in a device 2023-09-05
11742290 Interconnect structure and method of forming thereof Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng, Chih-Hsiang Chang +4 more 2023-08-29
11652044 Contact structure and method of making Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi, Chi-Feng Lin 2023-05-16