Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400862 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Chun-Sheng Chen, Nai-Hao Yang, Huei-Wen Hsieh, Yu-Cheng Hsiao +1 more | 2025-08-26 |
| 12354958 | Semiconductor devices and methods of formation | Shu-Cheng Chin, Chih-Chien Chi, Hsin-Ying Peng, Jau-Jiun Huang, Ya-Lien Lee +2 more | 2025-07-08 |
| 11694899 | Interconnect structures and methods and apparatuses for forming the same | Chun-Hsu Yang, Chun-Sheng Chen, Nai-Hao Yang, Huei-Wen Hsieh, Yu-Cheng Hsiao +1 more | 2023-07-04 |
| 11018055 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Hung-Wen Su | 2021-05-25 |
| 10522399 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Hung-Wen Su | 2019-12-31 |
| 10438846 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Hung-Wen Su | 2019-10-08 |
| 9567668 | Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method | Chih-Chien Chi, Shing-Chyang Pan, Yao-Jen Chang, Huang-Yi Huang, Ching-Hua Hsieh | 2017-02-14 |
| 9472449 | Semiconductor structure with inlaid capping layer and method of manufacturing the same | Shing-Chyang Pan, Chih-Chien Chi, Ching-Hua Hsieh | 2016-10-18 |
| 9275894 | Method for forming semiconductor device structure | Chi-Feng Lin, Ching-Hua Hsieh | 2016-03-01 |