Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394717 | Graphite-based interconnects and methods of fabrication thereof | Shu-Cheng Chin | 2025-08-19 |
| 12354958 | Semiconductor devices and methods of formation | Shu-Cheng Chin, Hsin-Ying Peng, Jau-Jiun Huang, Ya-Lien Lee, Kuan-Chia Chen +2 more | 2025-07-08 |
| 12334397 | Interconnect structure including graphite and method forming same | Shu-Cheng Chin, Chih-Yi Chang, Wei Hsiang Chan, Chi-Feng Lin, Hung-Wen Su | 2025-06-17 |
| 12322649 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Shu-Cheng Chin, Cheng-Hui Weng, Hung-Wen Su +1 more | 2025-06-03 |
| 12315764 | Conductive structures with barriers and liners of varying thicknesses | Shu-Cheng Chin, Chi-Feng Lin | 2025-05-27 |
| 12255144 | Graphene liners and caps for semiconductor structures | Shu-Cheng Chin, Chih-Yi Chang, Ming-Hsing Tsai | 2025-03-18 |
| 12237261 | Semiconductor device having a contact structure | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chi-Feng Lin | 2025-02-25 |
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 12166128 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2024-12-10 |
| 12159838 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2024-12-03 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2024-12-03 |
| 11996361 | Method of making a contact structure | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chi-Feng Lin | 2024-05-28 |
| 11894437 | Hybrid conductive structures | Shuen-Shin Liang, Chien-Shun Liao, Keng-Chu Lin, Kai-Ting Huang, Sung-Li Wang +4 more | 2024-02-06 |
| 11851749 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Hung-Wen Su | 2023-12-26 |
| 11830742 | Selective capping processes and structures formed thereby | Pei-Hsuan Lee, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2023-11-28 |
| 11791206 | Method for forming semiconductor device | Jung-Tang Wu, Pao-Sheng Chen, Pei-Hsuan Lee, Szu-Hua Wu | 2023-10-17 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2023-10-03 |
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2023-08-29 |
| 11682624 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2023-06-20 |
| 11652044 | Contact structure and method of making | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chi-Feng Lin | 2023-05-16 |
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2022-12-20 |
| 11380542 | Selective capping processes and structures formed thereby | Pei-Hsuan Lee, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2022-07-05 |
| 11374127 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2022-06-28 |
| 11345991 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Hung-Wen Su | 2022-05-31 |
| 11328952 | Interconnect structure and method | Chia-Cheng Chou, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2022-05-10 |