Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374595 | Package system and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang | 2025-07-29 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12243218 | Method and system for scanning wafer | Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin | 2025-03-04 |
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Chia-Hung Liu | 2024-12-24 |
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2024-12-03 |
| 12062832 | Electronic device and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2024-08-13 |
| 12061229 | In-line electrical detection of defects at wafer level | Yu-Hsuan Huang, Chien-Liang Chen | 2024-08-13 |
| 12040247 | Package system and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang | 2024-07-16 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chien Ling Hwang +3 more | 2024-05-21 |
| 11984365 | Semiconductor structure inspection using a high atomic number material | Hung-Ming Chen, Kuang-Shing Chen, Yu-Hsiang Cheng, Xiaomeng Chen | 2024-05-14 |
| 11830742 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2023-11-28 |
| 11791206 | Method for forming semiconductor device | Jung-Tang Wu, Pao-Sheng Chen, Szu-Hua Wu, Chih-Chien Chi | 2023-10-17 |
| 11783469 | Method and system for scanning wafer | Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin | 2023-10-10 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Chia-Hung Liu | 2023-09-12 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2023-08-29 |
| 11730816 | Debranching enzyme modified starch, the preparing method and use thereof in hard capsule production | Ruei-Jan Chang, Hsin-Yi Chao, Wei-Yu Chen | 2023-08-22 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2022-12-27 |
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2022-12-20 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chien Ling Hwang +3 more | 2022-11-15 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2022-09-13 |
| 11380542 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2022-07-05 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2022-03-22 |
| 11152258 | Method of forming an interconnect in a semiconductor device | Chih-Chien Chi, Yu Liu | 2021-10-19 |