Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121046 | Wafer-level testing method and test structure thereof | Yu-Hsuan Huang, Chia-Chia Kan | 2021-09-14 |
| 11075439 | Electronic device and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo | 2021-07-27 |
| 11037289 | Method and system for scanning wafer | Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin | 2021-06-15 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chien Ling Hwang +3 more | 2021-05-11 |
| 10879135 | Overlay error and process window metrology | Shang-Wei Fang, Jing-Sen Wang, Yuan-Yao Chang, Wei-Ray Lin, Ting-Hua Hsieh +1 more | 2020-12-29 |
| 10813887 | Acid resistant capsule shell composition | Ruei-Jan Chang, Yi-Huei Lin, Hsin-Yi Chao | 2020-10-27 |
| 10790142 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hsiao-Kuan Wei, Hung-Wen Su, Hsin-Yun Hsu, Jui-Fen Chien | 2020-09-29 |
| 10770288 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2020-09-08 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2020-08-25 |
| 10727118 | Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device | Jung-Tang Wu, Pao-Sheng Chen, Szu-Hua Wu, Chih-Chien Chi | 2020-07-28 |
| 10510623 | Overlay error and process window metrology | Shang-Wei Fang, Jing-Sen Wang, Yuan-Yao Chang, Wei-Ray Lin, Ting-Hua Hsieh +1 more | 2019-12-17 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 9887073 | Physical vapor deposition system and physical vapor depositing method using the same | Chih-Chien Chi, Hung-Wen Su | 2018-02-06 |
| 9805951 | Method of integration process for metal CMP | Chih-Chien Chi, Hung-Wen Su | 2017-10-31 |
| 9460939 | Package-on-package structures and methods of manufacture thereof | Chien Ling Hwang, Chung-Shi Liu, Chen-Hua Yu | 2016-10-04 |
| 9425179 | Chip packages and methods of manufacture thereof | Chien Ling Hwang, Ying-Jui Huang, Yeong-Jyh Lin, Chung-Shi Liu | 2016-08-23 |