Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo Lung Pan, Hao-Yi Tsai +4 more | 2025-09-02 |
| 12176279 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12040255 | Semiconductor package and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh | 2024-07-16 |
| 11764127 | Semiconductor package and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh | 2023-09-19 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2023-09-12 |
| 10985135 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2021-04-20 |