Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176279 | Package structure and manufacturing method thereof | Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2024-12-24 |
| 12040255 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Chien Ling Hwang, Ching-Hua Hsieh | 2024-07-16 |
| 11764127 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Chien Ling Hwang, Ching-Hua Hsieh | 2023-09-19 |
| 11756872 | Package structure and manufacturing method thereof | Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2023-09-12 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Ching-Hua Hsieh, Chen-Hua Yu, Hsin-Hung Liao, Chien Ling Hwang | 2022-12-20 |
| 10867890 | Mutli-chip package with encapsulated conductor via | Chien Ling Hwang, Ching-Hua Hsieh, Hsin-Hung Liao | 2020-12-15 |
| 10837754 | Wireless passive strain sensor having outer and inner coil holders | Wen-Syang Hsu, Cheng Tu, Chia-Min Chao | 2020-11-17 |
| 10052063 | Sensing bone fixing element | Wen-Syang Hsu, Tze-Hong Wong, Asher Sun | 2018-08-21 |
| 9867551 | Locating system for locking hole of intramedullary nail | Meng-Shiue Lee, Wensyang Hsu, Tze-Hong Wong, Tien-Kan Chung, Chia-Pei Wu | 2018-01-16 |