Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721555 | Method and system for thinning wafer thereof | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu | 2023-08-08 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Ching-Hua Hsieh, Chen-Hua Yu, Chien Ling Hwang, Sung-Yueh Wu | 2022-12-20 |
| 11233032 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2022-01-25 |
| 11139177 | Method of fabricating semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Ying-Jui Huang | 2021-10-05 |
| 11101232 | Conductive micro pin | Ying-Jui Huang, Chung-Shi Liu, Chien Ling Hwang | 2021-08-24 |
| 11094561 | Semiconductor package structure | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Ying-Jui Huang | 2021-08-17 |
| 10867890 | Mutli-chip package with encapsulated conductor via | Chien Ling Hwang, Ching-Hua Hsieh, Sung-Yueh Wu | 2020-12-15 |
| 10770331 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2020-09-08 |
| 10727074 | Method and system for thinning wafer thereof | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu | 2020-07-28 |
| 10679866 | Interconnect structure for semiconductor package and method of fabricating the interconnect structure | Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Ying-Jui Huang | 2020-06-09 |
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Chien Ling Hwang, Yu-Ting Chiu, Ching-Hua Hsieh | 2019-10-08 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10269582 | Package structure, fan-out package structure and method of the same | Chien Ling Hwang, Yu-Ting Chiu | 2019-04-23 |
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10115690 | Method of manufacturing micro pins and isolated conductive micro pin | Ying-Jui Huang, Chung-Shi Liu, Chien Ling Hwang | 2018-10-30 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2018-08-21 |
| 9984960 | Integrated fan-out package and method of fabricating the same | Chien Ling Hwang, Ching-Hua Hsieh, Ying-Jui Huang | 2018-05-29 |
| 9870929 | Package structure, fan-out package structure and method of the same | Chien Ling Hwang, Yu-Ting Chiu | 2018-01-16 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2018-01-16 |
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2017-11-07 |
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9498851 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9484226 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |