Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255095 | Semiconductor structure and manufacturing method thereof | Yu-Kai Lin, Tze-Liang Lee, Jen Hung Wang | 2025-03-18 |
| 12211766 | Highly protective wafer edge sidewall protection layer | Jr-Hung Li, Tze-Liang Lee | 2025-01-28 |
| 12198979 | Semiconductor device with multi-layer etch stop structure | Po-Cheng Shih, Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin | 2025-01-14 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Chih-Chien Chi +1 more | 2024-12-03 |
| 12094930 | Integrated circuit structure and method for forming the same | Guan-Yao Tu, Tze-Liang Lee, Hong-Wei Chan | 2024-09-17 |
| 12046557 | Interconnect structure and method of forming same | — | 2024-07-23 |
| 11923304 | Electro-migration barrier for interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2024-03-05 |
| 11848231 | Method for forming semiconductor device with multi-layer etch stop structure | Po-Cheng Shih, Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin | 2023-12-19 |
| 11670546 | Semiconductor structure and manufacturing method thereof | Yu-Kai Lin, Tze-Liang Lee, Jen Hung Wang | 2023-06-06 |
| 11532548 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Chih-Chien Chi +1 more | 2022-12-20 |
| 11515255 | Electro-migration barrier for interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2022-11-29 |
| 11502035 | Interconnect structure and method of forming same | — | 2022-11-15 |
| 11282742 | Semiconductor device with multi-layer etch stop structure and method for forming the same | Po-Cheng Shih, Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin | 2022-03-22 |
| 11264328 | Capping layer for improved deposition selectivity | Chao-Chun Wang | 2022-03-01 |
| 10867920 | Electro-migration barrier for Cu interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2020-12-15 |
| 10510666 | Interconnect structure and method of forming same | — | 2019-12-17 |
| 10163795 | Electro-migration barrier for Cu interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2018-12-25 |
| 10163794 | Capping layer for improved deposition selectivity | Chao-Chun Wang | 2018-12-25 |
| 9852905 | Systems and methods for uniform gas flow in a deposition chamber | — | 2017-12-26 |
| 9530728 | Semiconductor devices and methods of manufacture thereof | Yi-Nien Su | 2016-12-27 |
| 9490209 | Electro-migration barrier for Cu interconnect | Chih-Chiang Chang, Chia-Ho Chen | 2016-11-08 |
| 9396990 | Capping layer for improved deposition selectivity | Chao-Chun Wang | 2016-07-19 |
| 9355894 | Interconnect structure and method of forming the same | Yi-Nien Su | 2016-05-31 |
| 9129965 | Semiconductor devices and methods of manufacture thereof | Yi-Nien Su | 2015-09-08 |
| 9041216 | Interconnect structure and method of forming the same | Yi-Nien Su | 2015-05-26 |