Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152258 | Method of forming an interconnect in a semiconductor device | Pei-Hsuan Lee, Yu Liu | 2021-10-19 |
| 11004793 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2021-05-11 |
| 10840134 | Interconnect structure and method | Chia-Cheng Chou, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2020-11-17 |
| 10790142 | Selective capping processes and structures formed thereby | Hsiao-Kuan Wei, Hung-Wen Su, Pei-Hsuan Lee, Hsin-Yun Hsu, Jui-Fen Chien | 2020-09-29 |
| 10770288 | Selective capping processes and structures formed thereby | Pei-Hsuan Lee, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2020-09-08 |
| 10727350 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2020-07-28 |
| 10727118 | Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device | Jung-Tang Wu, Pao-Sheng Chen, Pei-Hsuan Lee, Szu-Hua Wu | 2020-07-28 |
| 10340223 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2019-07-02 |
| 10269627 | Interconnect structure and method | Chia-Cheng Chou, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2019-04-23 |
| 10199500 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2019-02-05 |
| 10103099 | Semiconductor devices and methods of forming same | Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2018-10-16 |
| 9917058 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2018-03-13 |
| 9887073 | Physical vapor deposition system and physical vapor depositing method using the same | Hung-Wen Su, Pei-Hsuan Lee | 2018-02-06 |
| 9873944 | Metal capping process and processing platform thereof | Szu-Ping Tung, Huang-Yi Huang, Ching-Hua Hsieh | 2018-01-23 |
| 9805951 | Method of integration process for metal CMP | Pei-Hsuan Lee, Hung-Wen Su | 2017-10-31 |
| 9754822 | Interconnect structure and method | Chia-Cheng Chou, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2017-09-05 |
| 9754882 | Interconnect structure having air gap and method of forming the same | Hung-Wen Su | 2017-09-05 |
| 9640428 | Self-aligned repairing process for barrier layer | Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2017-05-02 |
| 9576892 | Semiconductor devices and methods of forming same | Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2017-02-21 |
| 9567668 | Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method | Shing-Chyang Pan, Kuan-Chia Chen, Yao-Jen Chang, Huang-Yi Huang, Ching-Hua Hsieh | 2017-02-14 |
| 9543198 | Structure and method for forming interconnect structure | Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2017-01-10 |
| 9514928 | Selective repairing process for barrier layer | Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2016-12-06 |
| 9496169 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2016-11-15 |
| 9487864 | Metal capping process and processing platform thereof | Szu-Ping Tung, Huang-Yi Huang, Ching-Hua Hsieh | 2016-11-08 |
| 9472449 | Semiconductor structure with inlaid capping layer and method of manufacturing the same | Kuan-Chia Chen, Shing-Chyang Pan, Ching-Hua Hsieh | 2016-10-18 |