Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400875 | Film deposition for patterning process | Ssu-Yu Ho, Ching-Yu Chang | 2025-08-26 |
| 12374588 | Method for evaluating non-uniform stress | Wei-De Ho, Han-Wei Wu, Pei-Sheng TANG, Meng-Jung Lee, Hua-Tai Lin +1 more | 2025-07-29 |
| 12205824 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Chun-Kai Chen, Yi-Nien Su, Tze-Liang Lee | 2025-01-21 |
| 12159838 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2024-12-03 |
| 12057445 | Method of manufacturing a semiconductor device and a semiconductor device | Wen-Tzu Chen, Guan-Yao Tu, Hsiang-Ku Shen, Chen-Chiu Huang, Dian-Hau Chen | 2024-08-06 |
| 11991930 | Memory device and method for fabricating the same | Jung-Tang Wu, Szu-Hua Wu, Shing-Chyang Pan, Meng-Yu Wu | 2024-05-21 |
| 11804410 | Thin-film non-uniform stress evaluation | Wei-De Ho, Han-Wei Wu, Pei-Sheng TANG, Meng-Jung Lee, Hua-Tai Lin +1 more | 2023-10-31 |
| 11769693 | Metal-based etch-stop layer | Yu-Kai Lin, Jen Hung Wang, Shing-Chyang Pan | 2023-09-26 |
| 11715640 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Chun-Kai Chen, Tze-Liang Lee, Yi-Nien Su | 2023-08-01 |
| 11682624 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2023-06-20 |
| 11651993 | Etch stop layer for semiconductor devices | Jen Hung Wang, Shing-Chyang Pan | 2023-05-16 |
| 11515474 | Memory device and method for fabricating the same | Jung-Tang Wu, Szu-Hua Wu, Shing-Chyang Pan, Meng-Yu Wu | 2022-11-29 |
| 11322396 | Etch stop layer for semiconductor devices | Jen Hung Wang, Shing-Chyang Pan | 2022-05-03 |
| 11004793 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2021-05-11 |
| 11004734 | Metal-based etch-stop layer | Yu-Kai Lin, Jen Hung Wang, Shing-Chyang Pan | 2021-05-11 |
| 10867794 | Patterning method for semiconductor devices and structures resulting therefrom | Ching-Yu Chang, Jung-Hau Shiu, Chun-Kai Chen, Jen Hung Wang, Tze-Liang Lee | 2020-12-15 |
| 10862026 | Memory device | Jung-Tang Wu, Szu-Hua Wu, Shing-Chyang Pan, Meng-Yu Wu | 2020-12-08 |
| 10685873 | Etch stop layer for semiconductor devices | Jen Hung Wang, Shing-Chyang Pan | 2020-06-16 |
| 10535816 | Via structure, MRAM device using the via structure and method for fabricating the MRAM device | Jung-Tang Wu, Szu-Hua Wu, Shing-Chyang Pan, Meng-Yu Wu | 2020-01-14 |
| 10468297 | Metal-based etch-stop layer | Yu-Kai Lin, Jen Hung Wang, Shing-Chyang Pan | 2019-11-05 |
| 10340223 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2019-07-02 |
| 10103099 | Semiconductor devices and methods of forming same | Chih-Chien Chi, Huang-Yi Huang, Ching-Hua Hsieh | 2018-10-16 |
| 9917058 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2018-03-13 |
| 9873944 | Metal capping process and processing platform thereof | Chih-Chien Chi, Huang-Yi Huang, Ching-Hua Hsieh | 2018-01-23 |
| 9640428 | Self-aligned repairing process for barrier layer | Chih-Chien Chi, Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Ching-Hua Hsieh | 2017-05-02 |