Issued Patents All Time
Showing 1–25 of 160 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426291 | Contact and via structures for semiconductor devices | Mrunal A. Khaderbad | 2025-09-23 |
| 12412779 | Bilayer seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Chen-Han Wang, Tetsuji Ueno, Ting-Ting Chen | 2025-09-09 |
| 12400962 | Liner-free conductive structures with anchor points | Hsu-Kai Chang, Sung-Li Wang, Shuen-Shin Liang, Chia-Hung Chu | 2025-08-26 |
| 12389674 | Low resistance fill metal layer material as stressor in metal gates | Mrunal A. Khaderbad, Ziwei Fang, Hsueh Wen Tsau | 2025-08-12 |
| 12376321 | Semiconductor device with silicide structures surrounding epitaxial structures and method of making the same | Chen-Han Wang, Shuen-Shin Liang | 2025-07-29 |
| 12369388 | Semiconductor devices with tunable low-K inner air spacers | Chen-Han Wang, Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen | 2025-07-22 |
| 12368073 | Semiconductor device having air gap and method for manufacturing the same | Hung Yen | 2025-07-22 |
| 12363933 | Dielectric structures in semiconductor devices | Chien-Hung Lin, Ko-Feng Chen | 2025-07-15 |
| 12362234 | Contact structure for semiconductor device | Hsu-Kai Chang, Chia-Hung Chu, Shuen-Shin Liang, Pinyen Lin, Sung-Li Wang | 2025-07-15 |
| 12362224 | Semiconductor device and manufacturing method thereof | Kuo-Cheng Ching, Kuan-Lun Cheng, Chih-Hao Wang, Shi Ning Ju | 2025-07-15 |
| 12347717 | Debonding structures for wafer bonding | Wei-Ting Yeh, Zheng-Yong Liang, De-Yang Chiou, Yu-Yun Peng | 2025-07-01 |
| 12341013 | Method and structure for barrier-less plug | Sung-Li Wang, Hung-Yi Huang, Yu-Yun Peng, Mrunal A. Khaderbad, Chia-Hung Chu +1 more | 2025-06-24 |
| 12336214 | Inner spacers for gate-all-around semiconductor devices | Yu-Yun Peng, Fu-Ting Yen, Ting-Ting Chen, Tsu-Hsiu Perng | 2025-06-17 |
| 12328938 | Gate structures for stacked semiconductor devices | Mrunal A. Khaderbad, Sathaiya Mahaveer DHANYAKUMAR, Huicheng Chang | 2025-06-10 |
| 12324200 | Seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen, Chen-Han Wang | 2025-06-03 |
| 12315837 | Storage layers for wafer bonding | De-Yang Chiou, Yu-Yun Peng, Fu-Ting Yen | 2025-05-27 |
| 12308312 | Interconnect structure and method for manufacturing the interconnect structure | KHADERBAD MRUNAL ABHIJITH, Yu-Yun Peng, Fu-Ting Yen, Chen-Han Wang, Tsu-Hsiu Perng | 2025-05-20 |
| 12300540 | Conductive feature of semiconductor device and method of forming same | Bo-Yu Lai, Chin-Szu Lee, Szu-Hua Wu, Shuen-Shin Liang, Chia-Hung Chu +1 more | 2025-05-13 |
| 12288722 | Spacer structure for semiconductor device and method for forming the same | Han-Yu Lin, Jhih-Rong Huang, Yen-Tien Tung, Tzer-Min Shen, Fu-Ting Yen +3 more | 2025-04-29 |
| 12287575 | Photoresist and method of formation and use | Joung-Wei Liou, Cheng-Han Wu, Ya Hui Chang | 2025-04-29 |
| 12272752 | Gate all around (GAA) transistor structures having a plurality of semiconductor nanostructures | Shuen-Shin Liang, Pang-Yen Tsai, Sung-Li Wang, Pinyen Lin | 2025-04-08 |
| 12255239 | Liner layer for backside contacts of semiconductor devices | Mrunal A. Khaderbad, Yu-Yun Peng | 2025-03-18 |
| 12255249 | Inner spacer structures for gate-all-around field effect transistors | Mrunal A. Khaderbad, Yu-Yun Peng | 2025-03-18 |
| 12154822 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Shwang-Ming Jeng, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen | 2024-11-26 |
| 12148807 | Backside contact structures with stacked metal silicide layers for source/drain region of fin field transistors | Chia-Hung Chu, Ding-Kang Shih, Pang-Yen Tsai, Sung-Li Wang, Shuen-Shin Liang +2 more | 2024-11-19 |