Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154822 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Keng-Chu Lin, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen | 2024-11-26 |
| 11664268 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Keng-Chu Lin, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen | 2023-05-30 |
| 11069558 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Keng-Chu Lin, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen | 2021-07-20 |
| 10510580 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Keng-Chu Lin, Teng-Chun Tsai, Tsu-Hsiu Perng, Fu-Ting Yen | 2019-12-17 |
| 10312107 | Forming interconnect structure using plasma treated metal hard mask | Chung-Chi Ko, Chia-Cheng Chou, Shing-Chyang Pan, Keng-Chu Lin | 2019-06-04 |
| 10144109 | Polisher, polishing tool, and polishing method | Teng-Chun Tsai, Shen-Nan Lee, Yung-Cheng Lu, Chia-Chiung Lo, Yee-Chia Yeo | 2018-12-04 |
| 9589856 | Automatically adjusting baking process for low-k dielectric material | Chia-Cheng Chou, Chung-Chi Ko, Keng-Chu Lin | 2017-03-07 |
| 9368452 | Metal conductor chemical mechanical polish | Soon-Kang Huang, Han-Hsin Kuo, Chi-Ming Yang, Chin-Hsiang Lin | 2016-06-14 |
| 9196551 | Automatically adjusting baking process for low-k dielectric material | Chia-Cheng Chou, Chung-Chi Ko, Keng-Chu Lin | 2015-11-24 |
| 9087877 | Low-k interconnect structures with reduced RC delay | Chung-Chi Ko, Ting-Yu Shen, Keng-Chu Lin, Chia-Cheng Chou, Tien-I Bao +1 more | 2015-07-21 |
| 9004914 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Joung-Wei Liou, Mei-Ling Chen | 2015-04-14 |
| 8993435 | Low-k Cu barriers in damascene interconnect structures | Kuan-Chen Wang, Po-Cheng Shih, Chung-Chi Ko, Keng-Chu Lin | 2015-03-31 |
| 8877083 | Surface treatment in the formation of interconnect structure | Chia-Cheng Chou, Mei-Ling Chen, Hui-Chun Yang, Po-Cheng Shih, Joung-Wei Liou | 2014-11-04 |
| 8853858 | Curing low-k dielectrics for improving mechanical strength | Joung-Wei Liou, Keng-Chu Lin | 2014-10-07 |
| 8703612 | Process for forming contact plugs | Shich-Chang Suen, Liang-Guang Chen, He Hui Peng, Wne-Pin Peng | 2014-04-22 |
| 8673783 | Metal conductor chemical mechanical polish | Huang Soon Kang, Han-Hsin Kuo, Chi-Ming Yang, Chin-Hsiang Lin | 2014-03-18 |
| 8481412 | Method of and apparatus for active energy assist baking | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Joung-Wei Liou, Mei-Ling Chen | 2013-07-09 |
| 8324731 | Integrated circuit device | Chen-Hua Yu, Yung-Cheng Lu, Huilin Chang, Ting-Yu Shen, Yichi Liao | 2012-12-04 |
| 8258629 | Curing low-k dielectrics for improving mechanical strength | Joung-Wei Liou, Keng-Chu Lin | 2012-09-04 |
| 8105947 | Post etch dielectric film re-capping layer | Kin-Weng Wang, Hsin-Yi Tsai, Keng-Chu Lin, Chung-Chi Ko | 2012-01-31 |
| RE42514 | Extreme low-K dielectric film scheme for advanced interconnects | Fang Wen Tsai, Kuan-Chen Wang, Keng-Chu Lin, Chih-Lung Lin | 2011-07-05 |
| RE41935 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Keng-Chu Lin, Wen-Chih Chiou | 2010-11-16 |
| 7805692 | Method for local hot spot fixing | — | 2010-09-28 |
| 7723226 | Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio | Chen-Hua Yu, Yung-Cheng Lu, Pei-Ren Jeng, Chia-Cheng Chou, Keng-Chu Lin +2 more | 2010-05-25 |
| 7646097 | Bond pads and methods for fabricating the same | Chen-Hua Yu, Yung-Cheng Lu, Huilin Chang, Ting-Yu Shen, Yichi Liao | 2010-01-12 |