Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7626245 | Extreme low-k dielectric film scheme for advanced interconnect | Fang Wen Tsai, Kuan-Chen Wang, Keng-Chu Lin, Chih-Lung Lin | 2009-12-01 |
| 7485949 | Semiconductor device | Chung-Chi Ko, Chia-Cheng Chou, Zhen-Cheng Wu, Keng-Chu Lin | 2009-02-03 |
| 7465676 | Method for forming dielectric film to improve adhesion of low-k film | Fang Wen Tsai, I-I Chen, Zhen-Cheng Wu, Chih-Lung Lin, Tien-I Bao +1 more | 2008-12-16 |
| 7365026 | CxHy sacrificial layer for cu/low-k interconnects | Ming-Ling Yeh, Tien-I Bao, Keng-Chu Lin | 2008-04-29 |
| 7042049 | Composite etching stop in semiconductor process integration | Lain-Jong Li, Tien-I Bao, Syun-Ming Jang, Jun-Lung Huang, Jeng-Cheng Liu | 2006-05-09 |
| 6869836 | ILD stack with improved CMP results | Han-Ti Hsiaw, Shih-Ming Wang, Fu-Chi Hsu | 2005-03-22 |
| 6846756 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Shing-Chyang Pan, Keng-Chu Lin, Wen-Chih Chiou | 2005-01-25 |
| 6821905 | Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer | Shing-Chyang Pan, Chen-Hua Yu, Grace H. Ho | 2004-11-23 |
| 6753260 | Composite etching stop in semiconductor process integration | Lain-Jong Li, Tien-I Bao, Syun-Ming Jang, Jun-Lung Huang, Jeng-Cheng Liu | 2004-06-22 |
| 6657284 | Graded dielectric layer and method for fabrication thereof | Lain-Jong Li, Syun-Ming Jang, Chen-Hua Yu | 2003-12-02 |
| 6620745 | Method for forming a blocking layer | Syan-Mang Jang, Tien-I Bao, Lain-Jong Li | 2003-09-16 |
| 6372661 | Method to improve the crack resistance of CVD low-k dielectric constant material | Cheng-Chung Lin, Lain-Jong Li | 2002-04-16 |
| 6319809 | Method to reduce via poison in low-k Cu dual damascene by UV-treatment | Weng Chang, Lain-Jong Li, Syun-Ming Jang | 2001-11-20 |