Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8252682 | Method for thinning a wafer | Ku-Feng Yang, Weng-Jin Wu, Hsin-Hsien Lu, Chia-Lin Yu, Chu-Sung Shih +1 more | 2012-08-28 |
| 6869836 | ILD stack with improved CMP results | Han-Ti Hsiaw, Shwang-Ming Jeng, Shih-Ming Wang | 2005-03-22 |