Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705324 | Apparatus and method for wafer cleaning | Ting-Kui Chang, Jung-Tsan Tsai | 2023-07-18 |
| 11694909 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Chang-Sheng Lin | 2023-07-04 |
| 11594455 | Semiconductor device and manufacturing method for the same | Chih-Nan Lo, Ming-Chi Huang, Ming-Hsi Yeh, Kuo-Bin Huang | 2023-02-28 |
| 11458587 | Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system | Chang-Sheng Lin | 2022-10-04 |
| 10998184 | Apparatus and method for wafer cleaning | Ting-Kui Chang, Jung-Tsan Tsai | 2021-05-04 |
| 10770314 | Semiconductor device, tool, and method of manufacturing | Meng Li | 2020-09-08 |
| 10734254 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Chang-Sheng Lin | 2020-08-04 |
| 10504753 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Chang-Sheng Lin | 2019-12-10 |
| 10377013 | Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system | Chang-Sheng Lin | 2019-08-13 |
| 10325772 | Apparatus and method for wafer cleaning | Ting-Kui Chang, Jung-Tsan Tsai | 2019-06-18 |
| 9852899 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-12-26 |
| 9597771 | Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system | Chang-Sheng Lin | 2017-03-21 |
| 9601409 | Protruding contact for integrated chip | Chia-Fang Tsai | 2017-03-21 |
| 9576789 | Apparatus, method, and composition for far edge wafer cleaning | Ting-Kui Chang, Jung-Tsan Tsai | 2017-02-21 |
| 9559021 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-01-31 |
| 9466501 | Method and apparatus for improving CMP planarity | Chang-Sheng Lin | 2016-10-11 |
| 9434047 | Retainer ring | Kuo-Cheng Lien | 2016-09-06 |
| 9415479 | Conductive chemical mechanical planarization polishing pad | Chang-Sheng Lin | 2016-08-16 |
| 9287127 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2016-03-15 |
| 8921150 | Process to achieve contact protrusion for single damascene via | Chia-Fang Tsai | 2014-12-30 |
| 8889544 | Dielectric protection layer as a chemical-mechanical polishing stop layer | Yung-Hsu Wu, Tien-I Bao, Shau-Lin Shue | 2014-11-18 |
| 8828875 | Method and apparatus for improving CMP planarity | Chang-Sheng Lin | 2014-09-09 |
| 8348719 | Polisher for chemical mechanical planarization | Liang-Guang Chen, Tien-I Bao, Shau-Lin Shue | 2013-01-08 |
| 8252682 | Method for thinning a wafer | Ku-Feng Yang, Weng-Jin Wu, Chia-Lin Yu, Chu-Sung Shih, Fu-Chi Hsu +1 more | 2012-08-28 |
| 8021566 | Method for pre-conditioning CMP polishing pad | Chia-Che Chuang, Wen-Chih Chiou, Liang-Guang Chen | 2011-09-20 |