Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288960 | Method and system for control of laser emissions for safety | Hsiao-Hsien Weng, Zong-Syun He | 2025-04-29 |
| 12280482 | Driving device for electric nail gun | An-Gi LIU, Fu-Ying Huang | 2025-04-22 |
| 12251808 | Electric nail gun | An-Gi LIU, Guey-Horng Liou | 2025-03-18 |
| 12220798 | Electric power tool and method of controlling the same | Cheng-En Tsai, An-Gi LIU, Fu-Ying Huang | 2025-02-11 |
| 12131973 | Semiconductor device and method forming the same | Hsiu-Mei Yu, Guang-Yuan JIANG, Cheng-Yi Hsieh, Wei-Chan Chang | 2024-10-29 |
| 12011803 | Carrier head having abrasive structure on retainer ring | — | 2024-06-18 |
| 12009630 | Method and system for control of laser emissions for safety | Hsiao-Hsien Weng, Zong-Syun He | 2024-06-11 |
| 11935878 | Package structure and method for manufacturing the same | Hsiu-Mei Yu, Guang-Yuan JIANG, Cheng-Yi Hsieh, Wei-Chan Chang | 2024-03-19 |
| 11865684 | Pneumatic electric nail gun | An-Gi LIU, Fu-Ying Huang | 2024-01-09 |
| 11810804 | Method of forming dice and structure of die | Hsiu-Mei Yu, Wei-Chan Chang, Chun-Yi Wu | 2023-11-07 |
| 11694909 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Hsin-Hsien Lu | 2023-07-04 |
| 11588036 | High-efficiency packaged chip structure and electronic device including the same | Hsiu-Mei Yu, Cheng-Yi Hsieh, Wei-Chan Chang, Chun-Yi Wu | 2023-02-21 |
| 11458587 | Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system | Hsin-Hsien Lu | 2022-10-04 |
| 11415768 | Systematic fiber routing assembly for optical electronics | Zong-Syun He, Hsiao-Hsien Weng, Rong-Teng Sie | 2022-08-16 |
| 11312882 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien +1 more | 2022-04-26 |
| 11309201 | Method of forming dice and structure of die | Hsiu-Mei Yu, Wei-Chan Chang, Chun-Yi Wu | 2022-04-19 |
| 11011385 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Shen-Nan Lee, Yu-Wei Chou +3 more | 2021-05-18 |
| 10916473 | Method of cleaning wafer after CMP | Chien-Hao Chung, Kuo-Feng Huang, Li-Chieh Wu, Chun-Chieh Lin | 2021-02-09 |
| 10774241 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien +1 more | 2020-09-15 |
| 10770345 | Integrated circuit and fabrication method thereof | Tai-Yen Peng, Chien-Chung Huang, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang +3 more | 2020-09-08 |
| 10734254 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Hsin-Hsien Lu | 2020-08-04 |
| 10596963 | Fatigue alarm apparatus and method | Ta-Yi Chien, Pai-Hsiang Cheng, Ying-Ju Lai, Yung-Chou Chen, Guan-Hua Chen +3 more | 2020-03-24 |
| 10510594 | Method of cleaning wafer after CMP | Chien-Hao Chung, Kuo-Feng Huang, Li-Chieh Wu, Chun-Chieh Lin | 2019-12-17 |
| 10504753 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Hsin-Hsien Lu | 2019-12-10 |
| 10429600 | Optical transceiver | Chien-Te Lin, Ming-You LAI | 2019-10-01 |