Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11865666 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2024-01-09 |
| 11529712 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2022-12-20 |
| 11312882 | CMP slurry solution for hardened fluid material | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2022-04-26 |
| 11031391 | Method for manufacturing a FinFET device | Shen-Nan Lee, Pin-Chuan Su, Teng-Chun Tsai | 2021-06-08 |
| 11011385 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2021-05-18 |
| 10868180 | Method and structure for FinFET devices | Teng-Chun Tsai, Po-Yu Lin | 2020-12-15 |
| 10774241 | CMP slurry solution for hardened fluid material | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2020-09-15 |
| 10714615 | Method and structure for FinFET devices | Teng-Chun Tsai, Po-Yu Lin | 2020-07-14 |
| 10461080 | Method for manufacturing a FinFET device | Shen-Nan Lee, Pin-Chuan Su, Teng-Chun Tsai | 2019-10-29 |
| 10279311 | System and method for operating chemical mechanical polishing process | Chih-I Peng, Hsiang-Pi Chang, Cary Chia-Chiung Lo, Teng-Chun Tsai, Chih-Yuan Yang | 2019-05-07 |
| 10160091 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2018-12-25 |
| 10164102 | Method and structure for FinFET devices | Teng-Chun Tsai, Po-Yu Lin | 2018-12-25 |
| 9954105 | Method and structure for FinFET devices | Teng-Chun Tsai, Po-Yu Lin | 2018-04-24 |
| 9937536 | Air purge cleaning for semiconductor polishing apparatus | Chih-I Peng, Kun-Tai Wu, Teng-Chun Tsai, Hsiang-Pi Chang, Cary Chia-Chiung Lo | 2018-04-10 |
| 9852899 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more | 2017-12-26 |
| 9768303 | Method and structure for FinFET device | Teng-Chun Tsai, Po-Yu Lin | 2017-09-19 |
| 9748109 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2017-08-29 |
| 9592585 | System and method for CMP station cleanliness | Teng-Chun Tsai, Wan-Chun Pan, Hsiang-Pi Chang, Chi-Yuan Chang | 2017-03-14 |
| 9567493 | CMP slurry solution for hardened fluid material | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2017-02-14 |
| 9559021 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more | 2017-01-31 |
| 9508716 | Methods of manufacturing a semiconductor device | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, Chi-Yuan Chen, Wan-Chun Pan +5 more | 2016-11-29 |
| 9478431 | BARC-assisted process for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2016-10-25 |
| 9287127 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien +2 more | 2016-03-15 |
| 9236446 | Barc-assisted process for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2016-01-12 |
| 9153657 | Semiconductor devices comprising a fin | Chi-Yuan Chen, Teng-Chun Tsai, Wan-Chun Pan, Hsiang-Pi Chang, Shi Ning Ju +3 more | 2015-10-06 |