Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12427618 | Chemical-mechanical planarization pad and methods of use | Chih-Hung Chen, Shich-Chang Suen, Liang-Guang Chen, Wen P. Liao, Kei-Wei Chen | 2025-09-30 |
| 12424449 | CMP system and method of use | Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, William Weilun Hong, Kei-Wei Chen | 2025-09-23 |
| 12293917 | System and method for removing impurities during chemical mechanical planarization | Po-Chin Nien, Chih-Hung Chen, Ying-Tsung Chen, Kei-Wei Chen | 2025-05-06 |
| 11984323 | CMP system and method of use | Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, William Weilun Hong, Kei-Wei Chen | 2024-05-14 |
| 11865666 | CMP polishing head design for improving removal rate uniformity | Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2024-01-09 |
| 11529712 | CMP polishing head design for improving removal rate uniformity | Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2022-12-20 |
| 11389928 | Method for conditioning polishing pad | Shen-Nan Lee, Teng-Chun Tsai, Chung-Wei Hsu, Chen-Hao Wu | 2022-07-19 |
| 11069533 | CMP system and method of use | Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, William Weilun Hong, Kei-Wei Chen | 2021-07-20 |
| 10160091 | CMP polishing head design for improving removal rate uniformity | Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee, Teng-Chun Tsai +1 more | 2018-12-25 |