Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424449 | CMP system and method of use | Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, Kei-Wei Chen | 2025-09-23 |
| 12229487 | Hotspot avoidance method of manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, Chih-Hung Chen +1 more | 2025-02-18 |
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2025-02-11 |
| 11984323 | CMP system and method of use | Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, Kei-Wei Chen | 2024-05-14 |
| 11854821 | Hard mask removal method | Che-Hao Tu, Ying-Tsung Chen | 2023-12-26 |
| 11718812 | Post-CMP cleaning composition for germanium-containing substrate | Ji Cui, Gin-Chen Huang, Shich-Chang Suen, Kei-Wei Chen | 2023-08-08 |
| 11675953 | Hotspot avoidance method of manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, Chih-Hung Chen +1 more | 2023-06-13 |
| 11637021 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2023-04-25 |
| 11443095 | Hotspot avoidance method for manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, Chih-Hung Chen +1 more | 2022-09-13 |
| 11189497 | Chemical mechanical planarization using nano-abrasive slurry | Po-Chin Nien, Gang Huang | 2021-11-30 |
| 11133247 | Vias with metal caps for underlying conductive lines | Chia-Wei Ho, Chun-Wei Hsu, Chi-Hsiang Shen, Chi-Jen Liu, Yi-Sheng Lin +3 more | 2021-09-28 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Chi-Hsiang Shen +2 more | 2021-08-17 |
| 11069533 | CMP system and method of use | Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih-Hung Chen, Kei-Wei Chen | 2021-07-20 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung +4 more | 2021-06-15 |
| 10971370 | Hard mask removal method | Che-Hao Tu, Ying-Tsung Chen | 2021-04-06 |
| 10692732 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Chi-Hsiang Shen +2 more | 2020-06-23 |
| 10541139 | Planarization control in semiconductor manufacturing process | Po-Chin Nien, Ying-Tsung Chen | 2020-01-21 |
| 10522365 | Methods for reducing scratch defects in chemical mechanical planarization | Wan-Chun Pan, Ying-Tsung Chen | 2019-12-31 |
| 10510552 | Hard mask removal method | Che-Hao Tu, Ying-Tsung Chen | 2019-12-17 |
| 10068988 | Doped poly-silicon for PolyCMP planarity improvement | Po-Chin Nien, Ying-Tsung Chen | 2018-09-04 |
| 9960050 | Hard mask removal method | Che-Hao Tu, Ying-Tsung Chen | 2018-05-01 |
| 9941109 | Surface treatment in a chemical mechanical process | Chih-Wen Liu, Che-Hao Tu, Po-Chin Nien, Ying-Tsung Chen | 2018-04-10 |
| 9922837 | Asymmetric application of pressure to a wafer during a CMP process | Chih-Wen Liu, Che-Hao Tu, Po-Chin Nien, Ying-Tsung Chen | 2018-03-20 |
| 9871115 | Doped poly-silicon for polyCMP planarity improvement | Po-Chin Nien, Ying-Tsung Chen | 2018-01-16 |
| 9721831 | Method and apparatus for semiconductor planarization | Po-Chin Nien, Ying-Tsung Chen | 2017-08-01 |